Patterning Capabilities


Several different patterning technologies are in place at the Lurie Nanofabrication Facility (LNF), to address a wide range of requirements for resolution, throughput and cost.

TechnologyLNF instruments and capabilities
Contact Lithography4 Contact aligners
– Min. feature ~ 1.5µm
– Backside alignment capability
– Bond alignment

For more information:
https://lnf-wiki.eecs.umich.edu/wiki/Optical_lithography
Projection Lithographyi-line stepper
– Min. feature ~ 0.5µm
– 10mm square pieces up to 150mm substrate capability

For more information:
https://lnf-wiki.eecs.umich.edu/wiki/GCA_AS200_AutoStep
E-Beam LithographyJEOL JBX6300-FS E-Beam
– Min. feature 8nm
– Compatible with curved and transparent substrates 

For more information:
https://lnf-wiki.eecs.umich.edu/wiki/JEOL_JBX-6300FS_Electron_Beam_Lithography_System
Lithography Support– Automated photoresist coat/develop (cassette-to-cassette and single stations)
– Image reversal
– Mask cleaner

For more information:
https://lnf-wiki.eecs.umich.edu/wiki/Optical_lithography
Direct Write and Mask Making– Inkjet printing
– Direct write mask maker and laser writing (1µm)

For more information:
https://lnf-wiki.eecs.umich.edu/wiki/Direct_writing