Thin film deposition and annealing capabilities
The Lurie Nanofabrication Facility (LNF) offers a wide array of thin film growth, deposition, and annealing capabilities. For ion implantation, please contact University of Michigan’s Michigan Ion Beam Laboratory (MIBL).
| Technology | LNF instruments and capabilities |
|---|---|
| Diffusion/ Oxidation/ Doping/ Annealing | – 9 Furnace tubes: Diffusion/ Dry and Wet oxidation/ Annealing, Sintering, CNT/graphene, n- and p-type doping, n- and p-type anneal & oxidation – 2 Rapid Thermal Process tools – High-Temperature (1800C) Furnace – Bake ovens, Programmable curing oven (vacuum, inert, oxidative or reducing atmosphere) For more information: https://lnf-wiki.eecs.umich.edu/wiki/Annealing https://lnf-wiki.eecs.umich.edu/wiki/Thermal_oxidation |
| LPCVD/ PECVD/CVD | – 14 Furnace tubes for LPCVD (low and high temperature SiO2, Si3N4, SiOxNy, low stress SiN, undoped polySi, n- and p-type in-situ doped polySi, PSG, TEOS) – 2 PECVD systems +1 AMAT cluster tool (SiO2, Si3N4, SiOxNy, amorphous silicon with n- and p- type doped, intrinsic capability, TEOS) – Parylene For more information: https://lnf-wiki.eecs.umich.edu/wiki/Low_pressure_chemical_vapor_deposition https://lnf-wiki.eecs.umich.edu/wiki/Plasma_enhanced_chemical_vapor_deposition and https://lnf-wiki.eecs.umich.edu/wiki/SCS_PDS_2035CR |
| Physical Vapor Deposition | – 8 PVD Systems for Metals, Metal Oxides, Dielectrics, Compounds and Semiconductors For more information: https://lnf-wiki.eecs.umich.edu/wiki/Evaporation and https://lnf-wiki.eecs.umich.edu/wiki/Sputter_deposition |
| Atomic Layer Deposition | – 2 systems For more information: https://lnf-wiki.eecs.umich.edu/wiki/Atomic_layer_deposition |
| Electroplating | – Cu, Au, Ag, Pt, Ni, Fe-Ni, In For more information: https://lnf-wiki.eecs.umich.edu/wiki/Electroplating |