Etching

Lurie Nanofabrication Facility/Etching

The Lurie Nanofabrication Facility (LNF) offers a variety of wet etch and dry etch processes for different materials and applications.

TechnologyLNF instruments and capabilities
Dry Etching– 3 RIE + 1 AMAT cluster tool 
– 3 DRIE systems
– XeF2 etching of silicon
– Ion mill 
– Photoresist ashers, Wax etching, Plasma cleaner

For more information:
https://lnf-wiki.eecs.umich.edu/wiki/Plasma_etching
https://lnf-wiki.eecs.umich.edu/wiki/Xactix_XeF2
Dedicated Wet EtchingKOH, TMAH, and HF/HNO3

For more information:
https://lnf-wiki.eecs.umich.edu/wiki/Wet_chemical_processing
General Wet Processing16 Wet processing benches for general acid, base and solvent processes, wafer clean (piranha, ionic, RCA), and soft lithography (SU-8, PDMS)

For more information:
https://lnf-wiki.eecs.umich.edu/wiki/Wet_chemical_processing  
Other Process CapabilitiesCritical point dryers, rinser/dryers, Organic processing, and CO2 snow cleaners