The Lurie Nanofabrication Facility (LNF) provides extensive support for wafer bonding, lapping, chemical mechanical polishing, dicing, wire bonding, and flip-chip bonding.
| Technology | LNF instruments and capabilities |
| Wafer Bonding | – 3 Bonders for direct, Si-Si fusion, eutectic, polymer, anodic, thermo-compression – 2 Bond aligners, plasma surface activation, surface cleaner For more information: https://lnf-wiki.eecs.umich.edu/wiki/Substrate_bonding |
| Polishing | – Lapping – Chemical Mechanical Polishing of silicon, silicon oxide, silicon nitride, metals (Ni, Cu, NiP). – Post CMP cleaning For more information: https://lnf-wiki.eecs.umich.edu/wiki/Polishing |
| Flip-Chip and Wire Bonding | – Flip-Chip Bonder – 2 Systems for wedge and ball wire bonding For more information: https://lnf-wiki.eecs.umich.edu/wiki/Finetech_Flip_Chip_Bonder https://lnf-wiki.eecs.umich.edu/wiki/Wire_bonding |
| Dicing | Up to 6″ wafer dicing For more information: https://lnf-wiki.eecs.umich.edu/wiki/Dicing |