Wafer Bonding – Various mechanisms may be used to adhere two substrates together.

Flip Chip Bonding – Using a variety of materials, a chip is flipped, aligned and bonded with a substrate.

Wire Bonding – A mechanism for making interconnects between integrated circuits and external devices or printed circuit boards.

The LNF is a micro and nanofabrication facility.  Our primary fabrication technologies evolve from microchip fabrication.  These technologies have been tailored or modified to produce mechanical and optical devices in addition to electronics.  Most of our hardware can handle small pieces up to 150mm round substrates.  Silicon is the most common substrate material as it is relatively cheap, has a wide variety of useful properties, and is easy to machine.  III-V materials also have a long history at the LNF.  Substrates consisting of other materials with unique properties are becoming more common.  This lab excels at combining technologies and materials within a single device, for example, optical or mechanical sensors with integrated processing circuitry and on board power generation.

Some of our recent acquisitions offer new, exciting opportunities to push the limits of small scale fabrication.  These include a JEOL 6300FS  100kV E-beam system, 20 new 150mm Tempress furnace tubes, Kurt Lesker Lab 18 sputter systems, SPTS Pegasus deep silicon etchers, SPTS APS deep glass etcher, Tegal AlN sputter system, Hitachi SU8000 SEM, NanoInk nanopatterning system, NanoMan AFM.